Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/155936
Title: Toward miniaturizing microelectronics using covalent organic framework dielectric
Authors: Wiraja, Christian
Zhao, Yanli
Keywords: Science::Chemistry
Issue Date: 2021
Source: Wiraja, C. & Zhao, Y. (2021). Toward miniaturizing microelectronics using covalent organic framework dielectric. Matter, 4(6), 1760-1762. https://dx.doi.org/10.1016/j.matt.2021.04.021
Project: MOE-MOET2EP10120-0003
Journal: Matter
Abstract: As miniaturization of microelectronics reaches sub-10 nm scale, signal crosstalk and parasitic resistive-capacitive delay significantly limit device performance. While low dielectric constant (low-κ) dielectrics are widely recognized to address such issue, their poor thermal conductivity impedes heat management. Recently, scientists from Northwestern University and University of Virginia demonstrated the fabrication of pristine covalent organic framework (COF) thin films as a thermally conducting low-κ dielectric. Specifically, reported COF-5 film complements low-κ dielectric value (κ = 1.6) with high thermal conductivity (1 W m-1 K-1), offering promising adaptations in microelectronics with high power density.
URI: https://hdl.handle.net/10356/155936
ISSN: 2590-2385
DOI: 10.1016/j.matt.2021.04.021
Rights: © 2021 Elsevier Inc. All rights reserved. This paper was published in Matter and is made available with permission of Elsevier Inc.
Fulltext Permission: embargo_20220609
Fulltext Availability: With Fulltext
Appears in Collections:SCBE Journal Articles
SPMS Journal Articles

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