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Title: Integration of 2D materials on microscale thermistors
Authors: Wu, Yile
Keywords: Engineering::Materials
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Wu, Y. (2022). Integration of 2D materials on microscale thermistors. Final Year Project (FYP), Nanyang Technological University, Singapore.
Abstract: With the arrival of the twenty-first century, it is clear to see that people nowadays are highly dependent on computers. With the development of transistors, the size of computers keeps decreasing. However, high temperature and uneven temperature distribution become one of the major problems. The existing temperature sensors are either too large or not accurate enough. Recent developments regarding low dimensional materials such as CNT and graphene have drawn great attention attributed to the unique advantages of device downscaling. This report mainly focuses on the material preparation optimization of a new kind of two-dimensional (2D) composite material, AgVP2S6 (AVPS), which has been explored as a possible alternative temperature sensor. The exfoliation methods applied during sample preparation would be discussed and compared. Images taken by the optical microscope and atomic force microscope show that using Polydimethylsiloxane (PDMS) could gain high quality and micrometer-sized samples with fewer residues remaining, and a cleaner substrate. Hence, we identify using PDMS to exfoliate as the optimal method for our sample. This method will promote the process by providing a high yield of ideal samples and convenient operation.
Fulltext Permission: embargo_restricted_20240412
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

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