Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/156830
Title: Advanced thermally drawn multimaterial fibers: structure-enabled functionalities
Authors: Wang, Zhe
Chen, Mengxiao
Zheng, Yu
Zhang, Jing
Wang, Zhixun
Yang, Jiao
Zhang, Qichong
He, Bing
Qi, Miao
Zhang, Haozhe
Li, Kaiwei
Wei, Lei
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2021
Source: Wang, Z., Chen, M., Zheng, Y., Zhang, J., Wang, Z., Yang, J., Zhang, Q., He, B., Qi, M., Zhang, H., Li, K. & Wei, L. (2021). Advanced thermally drawn multimaterial fibers: structure-enabled functionalities. Advanced Devices & Instrumentation, 2021, 1-15. https://dx.doi.org/10.34133/2021/9676470
Project: MOE2019-T2-2-127
T2EP50120-0005
A2083c0062
RG90/19
RG73/19
NRF-CRP18-2017-02
Journal: Advanced Devices & Instrumentation
Abstract: Thermally drawn multimaterial fibers have experienced rapid development in the past two decades owing to the high scalability, uniformity, and material and structure compatibility of the thermal drawing technique. This article reviews various multimaterial fibers based on different functional structures and their applications in disparate fields. We start from the functional structures achieved in optical fibers developed in the early stage of thermally drawn fibers. Subsequently, we introduce both typical functional structures and unique structures created in multimaterial fibers for varying applications. Next, we present the early attempts in breaking the axial symmetric structures of thermally drawn fibers for extended functionalities. Additionally, we summarize the current progress on creating surface structures on thermally drawn fibers. Finally, we provide an outlook for this trending topic towards wearable devices and smart textiles.
URI: https://hdl.handle.net/10356/156830
ISSN: 2767-9713
DOI: 10.34133/2021/9676470
DOI (Related Dataset): 10.21979/N9/MPZYTJ
Rights: © 2021 Zhe Wang et al. Exclusive Licensee Beijing Institute of Aerospace Control Devices. Distributed under a Creative Commons Attribution License (CC BY 4.0).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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