Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/156834
Title: | Temperature-insensitive mechanical sensor using multi-modal behavior of antiresonant hollow-core fibers | Authors: | Goel, Charu Zang, Jichao Parrot, Matyas Yoo, Seongwoo |
Keywords: | Engineering::Electrical and electronic engineering | Issue Date: | 2021 | Source: | Goel, C., Zang, J., Parrot, M. & Yoo, S. (2021). Temperature-insensitive mechanical sensor using multi-modal behavior of antiresonant hollow-core fibers. Journal of Lightwave Technology, 39(12), 3998-4005. https://dx.doi.org/10.1109/JLT.2021.3049502 | Project: | QEP-P4 | Journal: | Journal of Lightwave Technology | Abstract: | We present the first report on a compact, temperature-insensitive, multi-axial mechanical force sensor based on a single-core antiresonant hollow-core fiber (ARHCF). Single-core antiresonant fibers are inherently few-moded in a short length and show characteristic multimode interference pattern in their transmission spectrum. We report here a simple technique that enhances the interaction between the interfering modes in these fibers, giving rise to up to four-fold increase in the peak-to-peak amplitude of the interference pattern. The enhanced interference pattern is shown to be responsive to external mechanical forces, like longitudinal and transverse strain and curvature, with distinguishable linear responses. Transverse and longitudinal mechanical forces affect different attributes of the interference pattern, making the proposed sensor suitable for their simultaneous sensing. The temperature sensitivity of the sensor is found to be 3.3 pm/°C suggesting negligible thermal crosstalk while measuring the effect of mechanical forces. The sensor has a compact configuration and is inherently insensitive to polarization of light used. | URI: | https://hdl.handle.net/10356/156834 | ISSN: | 0733-8724 | DOI: | 10.1109/JLT.2021.3049502 | Schools: | School of Electrical and Electronic Engineering | Research Centres: | The Photonics Institute | Rights: | © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/JLT.2021.3049502. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Journal Articles |
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