Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/156834
Title: Temperature-insensitive mechanical sensor using multi-modal behavior of antiresonant hollow-core fibers
Authors: Goel, Charu
Zang, Jichao
Parrot, Matyas
Yoo, Seongwoo
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2021
Source: Goel, C., Zang, J., Parrot, M. & Yoo, S. (2021). Temperature-insensitive mechanical sensor using multi-modal behavior of antiresonant hollow-core fibers. Journal of Lightwave Technology, 39(12), 3998-4005. https://dx.doi.org/10.1109/JLT.2021.3049502
Project: QEP-P4
Journal: Journal of Lightwave Technology
Abstract: We present the first report on a compact, temperature-insensitive, multi-axial mechanical force sensor based on a single-core antiresonant hollow-core fiber (ARHCF). Single-core antiresonant fibers are inherently few-moded in a short length and show characteristic multimode interference pattern in their transmission spectrum. We report here a simple technique that enhances the interaction between the interfering modes in these fibers, giving rise to up to four-fold increase in the peak-to-peak amplitude of the interference pattern. The enhanced interference pattern is shown to be responsive to external mechanical forces, like longitudinal and transverse strain and curvature, with distinguishable linear responses. Transverse and longitudinal mechanical forces affect different attributes of the interference pattern, making the proposed sensor suitable for their simultaneous sensing. The temperature sensitivity of the sensor is found to be 3.3 pm/°C suggesting negligible thermal crosstalk while measuring the effect of mechanical forces. The sensor has a compact configuration and is inherently insensitive to polarization of light used.
URI: https://hdl.handle.net/10356/156834
ISSN: 0733-8724
DOI: 10.1109/JLT.2021.3049502
Schools: School of Electrical and Electronic Engineering 
Research Centres: The Photonics Institute 
Rights: © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/JLT.2021.3049502.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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