Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/156844
Title: A 13.5-Gb/s 140-GHz silicon redriver exploiting metadevices for short-range OOK communications
Authors: Liang, Yuan
Boon, Chirn Chye
Zhang, Haochi
Tang, Xiao-Lan
Zhang, Qingfeng
Yu, Hao
Keywords: Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2021
Source: Liang, Y., Boon, C. C., Zhang, H., Tang, X., Zhang, Q. & Yu, H. (2021). A 13.5-Gb/s 140-GHz silicon redriver exploiting metadevices for short-range OOK communications. IEEE Transactions On Microwave Theory and Techniques, 70(1), 239-253. https://dx.doi.org/10.1109/TMTT.2021.3124215
Project: MOE2019-T2-1-114
Journal: IEEE Transactions on Microwave Theory and Techniques
Abstract: The effort to confine the electromagnetic field by silicon passive metadevices has made the design of an on-chip wideband sub-terahertz (sub-THz) I/O redriver feasible, paving a new way toward energy-efficient and crosstalk-immune ON-OFF keying (OOK) communications. Two metadevices, namely spoof surface plasmon polaritons (SPPs) metawaveguide and split-ring resonator (SRR), are exploited to build the sub-THz low-crosstalk silicon channel and high-ON-OFF-ratio modulator, respectively. A sub-THz signal source combining the merit of spoof SPPs and SRR is introduced. A 140-GHz dual-channel redriver composed of these metadevices is fully integrated in a 65-nm CMOS technology. The redriver realizes both 27-1 and 231-1 13.5 Gb/s/lane for dual-channel OOK modulation. The measured energy efficiency is 2.6 pJ/bit/lane and the bit error rate (BER) is ≤10-12, demonstrating a crosstalk-immune sub-THz I/O system. The power consumption is 35.1 mW/lane and the active area of the redriver is 0.23 mm2.
URI: https://hdl.handle.net/10356/156844
ISSN: 0018-9480
DOI: 10.1109/TMTT.2021.3124215
Schools: School of Electrical and Electronic Engineering 
Rights: © 2021 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TMTT.2021.3124215.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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