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https://hdl.handle.net/10356/156854
Title: | Recent advances in optical fiber enabled radiation sensors | Authors: | Zhang, Jing Xiang, Yudiao Wang, Chen Chen, Yunkang Tjin, Swee Chuan Wei, Lei |
Keywords: | Engineering::Electrical and electronic engineering | Issue Date: | 2022 | Source: | Zhang, J., Xiang, Y., Wang, C., Chen, Y., Tjin, S. C. & Wei, L. (2022). Recent advances in optical fiber enabled radiation sensors. Sensors, 22(3), 1126-. https://dx.doi.org/10.3390/s22031126 | Project: | MOE2019-T2-2-127 MOE-T2EP50120-0002 A2083c0062 MOE2019- T1-001-103 (RG 73/19) MOE2019-T1-001-111 (RG90/19) NRF-CRP18-2017-02 |
Journal: | Sensors | Abstract: | Optical fibers are being widely utilized as radiation sensors and dosimeters. Benefiting from the rapidly growing optical fiber manufacturing and material engineering, advanced optical fibers have evolved significantly by using functional structures and materials, promoting their detection accuracy and usage scenarios as radiation sensors. This paper summarizes the current development of optical fiber-based radiation sensors. The sensing principles of both extrinsic and intrinsic optical fiber radiation sensors, including radiation-induced attenuation (RIA), radiation-induced luminescence (RIL), and fiber grating wavelength shifting (RI-GWS), were analyzed. The relevant advanced fiber materials and structures, including silica glass, doped silica glasses, polymers, fluorescent and scintillator materials, were also categorized and summarized based on their characteristics. The fabrication methods of intrinsic all-fiber radiation sensors were introduced, as well. Moreover, the applicable scenarios from medical dosimetry to industrial environmental monitoring were discussed. In the end, both challenges and perspectives of fiber-based radiation sensors and fiber-shaped radiation dosimeters were presented. | URI: | https://hdl.handle.net/10356/156854 | ISSN: | 1424-8220 | DOI: | 10.3390/s22031126 | DOI (Related Dataset): | 10.21979/N9/IGOLEA | Schools: | School of Electrical and Electronic Engineering | Rights: | © 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/). | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Journal Articles |
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