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|Title:||Characterisation and optimisation of a novel carbon nanotube transfer technique for board-level electromagnetic shielding applications||Authors:||Chan, Alvin Choon Hong||Keywords:||Engineering::Electrical and electronic engineering||Issue Date:||2022||Publisher:||Nanyang Technological University||Source:||Chan, A. C. H. (2022). Characterisation and optimisation of a novel carbon nanotube transfer technique for board-level electromagnetic shielding applications. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/157408||Abstract:||As society moves towards the digital world, technological advancement is inevitable. With technology on the rise, the need for state-of-the-art electronic devices is high in terms of performance and portability, i.e., devices are getting faster and smaller. Therefore, the conventional method to protect such devices from electromagnetic interference has become an issue. Studies have found that carbon nanotubes could be the alternative material for electromagnetic shielding. However, synthesising carbon nanotubes directly onto the microelectronic device isn’t ideal owing to the high temperature. Hence, a novel carbon nanotubes transfer technique is studied. In this project, the aim is to achieve lower bonding temperature and bonding duration while achieving the same outcome from previous studies. With the lowering of bonding temperature, more temperature-sensitive devices can explore such alternative for carbon nanotubes to be transfer to it. Also, lowering the bonding duration allows reducing the time needed to complete a transfer and thus a higher throughput. Characterisation is done using Scanning Electron Microscope. Multiple process parameters, such as temperature, duration, and carbon nanotubes grown on different type of substrates and different etch duration, are studied throughout this project. The results are analysed, and discussions are given.||URI:||https://hdl.handle.net/10356/157408||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Student Reports (FYP/IA/PA/PI)|
Updated on May 15, 2022
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