Please use this identifier to cite or link to this item:
Title: Electromagnetic simulation of high-speed board
Authors: Tay, Amanda Kia Gek
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Tay, A. K. G. (2022). Electromagnetic simulation of high-speed board. Final Year Project (FYP), Nanyang Technological University, Singapore.
Project: B2193-211
Abstract: With electronic devices becoming prevalent in our world as we step into digitalization, Electromagnetic Compatibility (EMC) is of increasing importance. In consumer electronics nowadays, compliance with these EMC requirements is obligatory by companies and industry standards. As we demand smaller electronics that work even faster, companies have to produce smaller high-speed boards in these electronic devices to meet consumer demands. With the smaller size of these high-speed Printed Circuit Boards (PCBs), undesired electromagnetic radiation may be emitted and cause device failures or degrade the lifespan and performance of the other electronic components should EMC not be taken into consideration. This report presents the process of simulation and its results of an actual high-speed board used in printers using Computer Simulation Technology (CST) Studio Suite to achieve inherently EMC compliant boards.
Schools: School of Electrical and Electronic Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
B2193-211_Final Report.pdf
  Restricted Access
8.59 MBAdobe PDFView/Open

Page view(s)

Updated on Apr 19, 2024


Updated on Apr 19, 2024

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.