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dc.contributor.authorTay, Amanda Kia Geken_US
dc.identifier.citationTay, A. K. G. (2022). Electromagnetic simulation of high-speed board. Final Year Project (FYP), Nanyang Technological University, Singapore.
dc.description.abstractWith electronic devices becoming prevalent in our world as we step into digitalization, Electromagnetic Compatibility (EMC) is of increasing importance. In consumer electronics nowadays, compliance with these EMC requirements is obligatory by companies and industry standards. As we demand smaller electronics that work even faster, companies have to produce smaller high-speed boards in these electronic devices to meet consumer demands. With the smaller size of these high-speed Printed Circuit Boards (PCBs), undesired electromagnetic radiation may be emitted and cause device failures or degrade the lifespan and performance of the other electronic components should EMC not be taken into consideration. This report presents the process of simulation and its results of an actual high-speed board used in printers using Computer Simulation Technology (CST) Studio Suite to achieve inherently EMC compliant boards.en_US
dc.publisherNanyang Technological Universityen_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleElectromagnetic simulation of high-speed boarden_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorSee Kye Yaken_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineering (Electrical and Electronic Engineering)en_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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