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dc.contributor.authorLee, Jun Weeen_US
dc.identifier.citationLee, J. W. (2022). Exploring electromagnetic properties of smart materials for future building applications (part 2). Final Year Project (FYP), Nanyang Technological University, Singapore.
dc.description.abstractThis study presents a methodology to explore, compare and understand the electromagnetic (EM) properties and behaviour of common building materials at 5G frequencies by conducting experiments in a Microwave Anechoic Chamber. Using a pair of broadband horn antenna connected to the Vector Network Analyzer (VNA), EM plane waves were transmitted from one end through the Material Under Test (MUT) and received on the other. It was important to consider that the EM plane waves passes through the MUT in the far field region. S21 parameters were then measured and recorded for each of the MUT. To analyse and verify the trend of S21 parameters obtained from the experiment conducted in the Microwave Anechoic Chamber, a similar experiment was conducted using a waveguide. This experiment involves placing the MUT in a section of the waveguide and measuring the S21 parameters with a VNA. Calibration must be carried out before taking any measurements such that the normalised attenuation loss due to free space will be approximately 0 dB. The results from the experiments conducted was then analysed and discussed to form relationships between the shielding effectiveness (SE) value of the material and the variable factor of the experiment such as frequency, thickness, and constituents of the material.en_US
dc.publisherNanyang Technological Universityen_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleExploring electromagnetic properties of smart materials for future building applications (part 2)en_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorSoong Boon Heeen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineering (Electrical and Electronic Engineering)en_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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