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|Title:||Comfort living analysis in smart living environment||Authors:||Lee, Sean Jian Hui||Keywords:||Engineering::Electrical and electronic engineering::Control and instrumentation::Control engineering||Issue Date:||2022||Publisher:||Nanyang Technological University||Source:||Lee, S. J. H. (2022). Comfort living analysis in smart living environment. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/157701||Abstract:||The thermal environment is a key factor that influences the thermal comfort and, consequentially, the productivity of occupants. The installation of the Heating Ventilating Air Conditioning (HVAC) systems provides adequate comfort to occupants within buildings. Thermal comfort is commonly assessed by the computation of the Predicted Mean Vote (PMV). Throughout the years, research has discussed the relationship between thermal comfort and productivity. To predict the changes in the thermal comfort of occupants, numerous studies have formulated the PMV models to study and analyze how the thermal variation of the environment influences the overall comfort. However, with a wide variation in the study of the PMV models, the understanding of this subject has become enigmatic. This Final Year Project (FYP) will focus on exploring a simple and systematic model with the aim of understanding the relationship between thermal comfort and productivity. Also, how the environmental and personal factors may influence the productivity of occupants. In addition, to propose a solution that can be used as a platform to apply the knowledge and understanding from the study of the thermal comfort of occupants. To achieve these objectives, exploring different prediction algorithms will be carried out. After which, simulations will be conducted to obtain results to validate the claims and assumptions made.||URI:||https://hdl.handle.net/10356/157701||Schools:||School of Electrical and Electronic Engineering||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Student Reports (FYP/IA/PA/PI)|
Updated on Sep 24, 2023
Updated on Sep 24, 2023
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