Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/157701
Title: Comfort living analysis in smart living environment
Authors: Lee, Sean Jian Hui
Keywords: Engineering::Electrical and electronic engineering::Control and instrumentation::Control engineering
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Lee, S. J. H. (2022). Comfort living analysis in smart living environment. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/157701
Abstract: The thermal environment is a key factor that influences the thermal comfort and, consequentially, the productivity of occupants. The installation of the Heating Ventilating Air Conditioning (HVAC) systems provides adequate comfort to occupants within buildings. Thermal comfort is commonly assessed by the computation of the Predicted Mean Vote (PMV). Throughout the years, research has discussed the relationship between thermal comfort and productivity. To predict the changes in the thermal comfort of occupants, numerous studies have formulated the PMV models to study and analyze how the thermal variation of the environment influences the overall comfort. However, with a wide variation in the study of the PMV models, the understanding of this subject has become enigmatic. This Final Year Project (FYP) will focus on exploring a simple and systematic model with the aim of understanding the relationship between thermal comfort and productivity. Also, how the environmental and personal factors may influence the productivity of occupants. In addition, to propose a solution that can be used as a platform to apply the knowledge and understanding from the study of the thermal comfort of occupants. To achieve these objectives, exploring different prediction algorithms will be carried out. After which, simulations will be conducted to obtain results to validate the claims and assumptions made.
URI: https://hdl.handle.net/10356/157701
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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