Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/157841
Title: Development of 3D VR models and animations
Authors: Wu, Hao
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Wu, H. (2022). Development of 3D VR models and animations. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/157841
Abstract: The use virtual reality is widely used in market as of today, it is a computer modelling technique that simulates the real world environment. The virtual reality environment is able to simulate human senses such as sight, touch and hearing. In order to generate a three dimensional environment effect, stereoscopic pair images have to be formed on the display for the view of both the left and right eyes of a human at different angles. 2D image can only store partial distribution of the light intensity of the subject, which cannot meet the expectations required to perceive the requirements of a real 3D scene. In the long run, people have made unremitted efforts to realize the dynamic 3D display technology and significant research has been done on 3D display methods and system implementation, which has led to the great development of various 3D stereo display technologies. Stereo display is the main type of three-dimension display. It uses parallax to achieve depth sensitivity of the human eye. Stereo displays can also be divided into three dimensional displays that require the wearing of auxiliary glasses such as anaglyphic Glass, active shutter glass and polarization glass. This article is mainly focused on an software based approach by creating a multi-view port to generate a three dimensional model. The conversion of left and right images is done by 3D television and merged into a 3D effect image. With the help of OpenGL API we are able to generate a live rendering three dimension model which is widely adopted by the military and entertainment industry.
URI: https://hdl.handle.net/10356/157841
Schools: School of Electrical and Electronic Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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