Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/158029
Title: Intelligent robotic grasping and manipulation system with deep learning
Authors: Chu, You-Rui
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Chu, Y. (2022). Intelligent robotic grasping and manipulation system with deep learning. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/158029
Abstract: Random object grasping is a crucial problem in robotics which is yet to be solved. Typically, vision-based robotic grasping can be classified into two approaches, 2D planar grasp and 6-DoF (degree of freedom) grasp. In this project, the focus will be on the prediction of 6-DoF grasp poses based on RGB-D images. Most of the current approaches for 6-DoF grasp are generated from point clouds or unstable depth images, which may lead to undesirable results in some cases. The proposed method divides the 6-DoF grasp detection into three sub-stages. The first stage is the LocNet, a convolutional-based encoder-decoder neural network to predict the location of the objects in the image. Besides, ViewAngleNet is also a convolutional-based encoder-decoder neural network that predicts the 3D rotation groups of the gripper at the image location of the objects, similar to LocNet but with a different output head. Afterwards, an analytical search algorithm will determine the gripper's opening width and the gripper’s distance from the grasp point. Real-world experiments are conducted with a UR10 robot arm, an Intel Realsense camera and a Robotiq two-finger gripper on single-object scenes and cluttered scenes, which show satisfactory success rates.
URI: https://hdl.handle.net/10356/158029
Schools: School of Electrical and Electronic Engineering 
Research Centres: Singapore Institute of Manufacturing Technology 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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