Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/158248
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dc.contributor.authorYap, Bradley Ming Enen_US
dc.date.accessioned2022-06-02T01:59:38Z-
dc.date.available2022-06-02T01:59:38Z-
dc.date.issued2022-
dc.identifier.citationYap, B. M. E. (2022). Nanoimprinting of copper nanowires at low temperature. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/158248en_US
dc.identifier.urihttps://hdl.handle.net/10356/158248-
dc.description.abstractMany methods of lithography to produce copper nanowires have been in manufacturing industries for a long time. In addition, the occurrence of oxidation heavily affects the results of the nanowires turning desirable copper nanowires into unwanted copper oxide nanowires. However, they require high temperature and energy to conduct. This introduced the various methods of lithography to use low temperature or room temperature lithography to reduce energy used to supply the high temperature. With the introduction of ultrasonic nanoimprinting, the usage of lithography has been less desirable as ultrasonic nanoimprinting overcomes the problems of high energy usage and long cycle time. In this project, it is aimed to produce copper nanowires through the usage of ultrasonic nanoimprint with the addition of using low temperature. The copper nanowire aimed to produce should be of reasonable length and uniformity. Experimenting around with the various parameters and different external ways to aid with the aim of this project will be the guidelines of this report. The findings obtained from this report serve as a gauge and guide to the recommended parameters, methods, and choice to improve the accuracy and results of the low temperature nanoimprinting process.en_US
dc.language.isoenen_US
dc.publisherNanyang Technological Universityen_US
dc.relationA101en_US
dc.subjectEngineering::Mechanical engineeringen_US
dc.titleNanoimprinting of copper nanowires at low temperatureen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorHong Lien_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
dc.contributor.supervisoremailehongli@ntu.edu.sgen_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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