Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/159070
Title: Development of copper wire laying techniques for 3D printing
Authors: Lim, Shan De
Keywords: Engineering::Mechanical engineering
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Lim, S. D. (2022). Development of copper wire laying techniques for 3D printing. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/159070
Project: B275
Abstract: Additive manufacturing has evolved beyond fabricating standard components that possess only mechanical or structural functionalities into manufacturing components with multiple functionalities (multi-functional components). And the outlook of a standard 3D printer has changed into a multiple-process (multi-process) 3D printer or a hybrid 3D printer that fabricates parts with multi-functionalities. Recent interest in additive manufacturing came from the numerous benefits that additive manufacturing gives when employed to fabricate 3D electronics with multi-functionalities. This project aims to develop an automated large format hybrid 3D printer capable of embedding copper wire into its 3D printed substrate. In the literature review section, existing hybrid 3D printed with wire embedding capability and the application of such technology will be explored. In the material and methodology section, two newly developed copper wire laying techniques, the integration of plastic and copper wire printing, and a prototype cutter mechanism are detailed. Thus, an automated copper wire embedded print can be fabricated with the printer's functions established. Print characteristics, wire embedding quality, and substrate printing parameters range are then detailed. And finally, a multi-layer copper wire embedding print is manufactured as a heater application.
URI: https://hdl.handle.net/10356/159070
Fulltext Permission: embargo_restricted_20230527
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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U1821494A FYP Report - B275 [Final].pdf
  Until 2023-05-27
15.53 MBAdobe PDFUnder embargo until May 27, 2023

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