Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/159401
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dc.contributor.authorLye, Celescia Siew Munen_US
dc.contributor.authorWang, Zhongkeen_US
dc.contributor.authorLam, Yee Cheongen_US
dc.date.accessioned2022-06-16T01:20:01Z-
dc.date.available2022-06-16T01:20:01Z-
dc.date.issued2021-
dc.identifier.citationLye, C. S. M., Wang, Z. & Lam, Y. C. (2021). Multi-foci division of nonlinear energy absorption on ultrashort pulse laser singulation of sapphire wafers. Micromachines, 12(11), 1328-. https://dx.doi.org/10.3390/mi12111328en_US
dc.identifier.issn2072-666Xen_US
dc.identifier.urihttps://hdl.handle.net/10356/159401-
dc.description.abstractThe multi-foci division of through thickness nonlinear pulse energy absorption on ultrashort pulse laser singulation of single side polished sapphire wafers has been investigated. Firstly, it disclosed the enhancement of energy absorption by the total internal reflection of the laser beam exiting from an unpolished rough surface. Secondly, by optimizing energy distribution between foci and their proximity, favorable multi-foci energy absorption was induced. Lastly, for effective nonlinear energy absorption for wafer separation, it highlighted the importance of high laser pulse energy fluence at low pulse repetition rates with optimized energy distribution, and the inadequacy of increasing energy deposition through reducing scanning speed alone. This study concluded that for effective wafer separation, despite the lower pulse energy per focus, energy should be divided over more foci with closer spatial proximity. Once the power density per pulse per focus reached a threshold in the order of 1012 W/cm2, with approximately 15 μm between two adjacent foci, wafer could be separated with foci evenly distributed over the entire wafer thickness. When the foci spacing reduced to 5 μm, wafer separation could be achieved with pulse energy concentrated only at foci distributed over only the upper or middle one-third wafer thickness.en_US
dc.description.sponsorshipAgency for Science, Technology and Research (A*STAR)en_US
dc.language.isoenen_US
dc.relationU12-M-007JLen_US
dc.relation.ispartofMicromachinesen_US
dc.rights© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).en_US
dc.subjectEngineering::Mechanical engineeringen_US
dc.titleMulti-foci division of nonlinear energy absorption on ultrashort pulse laser singulation of sapphire wafersen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.researchSIMTech-NTU Joint Laboratoryen_US
dc.contributor.researchSingapore Institute of Manufacturing Technologyen_US
dc.identifier.doi10.3390/mi12111328-
dc.description.versionPublished versionen_US
dc.identifier.pmid34832740-
dc.identifier.scopus2-s2.0-85118499459-
dc.identifier.issue11en_US
dc.identifier.volume12en_US
dc.identifier.spage1328en_US
dc.subject.keywordsPulse Energy Divisionen_US
dc.subject.keywordsSpatial Proximity of Focien_US
dc.description.acknowledgementThe research work was supported by A*STAR Research Agency, Singapore Institute of Manufacturing Technology (SIMTech) under SIMTech-NTU Joint Laboratory with project No. U12-M-007JL.en_US
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