Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/159947
Title: Buckling analysis of cracked orthotropic 3D plates and shells via an isogeometric-reproducing kernel particle method
Authors: Kiran, Raj
Nguyen-Thanh, Nhon
Huang, Jiazhao
Zhou, Kun
Keywords: Engineering::Mechanical engineering
Engineering::Electrical and electronic engineering
Issue Date: 2021
Source: Kiran, R., Nguyen-Thanh, N., Huang, J. & Zhou, K. (2021). Buckling analysis of cracked orthotropic 3D plates and shells via an isogeometric-reproducing kernel particle method. Theoretical and Applied Fracture Mechanics, 114, 102993-. https://dx.doi.org/10.1016/j.tafmec.2021.102993
Journal: Theoretical and Applied Fracture Mechanics
Abstract: This paper aims to develop a three-dimensional isogeometric-reproducing kernel particle method (IGA-RKPM) coupling approach to study the buckling behavior of cracked isotropic and orthotropic plate and shell structures. The IGA and RKPM-based meshfree methods are coupled successfully through a reproducing condition in the physical domain that guarantees the higher-order polynomial continuity of basis functions and overcomes the barrier of global parameterization in the physical domain. The resulting coupling approach not only preserves the geometry exactness and offers a higher-order approximation based on IGA basis functions but also allows local refinement flexibility. Linear eigenvalue buckling analyses for cracked orthotropic plate and shell structures have been carried out within the framework of the proposed coupling approach. The effects of several parameters such as the crack length ratio, thickness-to-length ratio, and orthotropy angle on the critical buckling stress of the structures have been investigated in detail under different boundary and loading conditions. The efficacy and robustness of the proposed coupling approach have been demonstrated by comparing the present results with those available in literature.
URI: https://hdl.handle.net/10356/159947
ISSN: 0167-8442
DOI: 10.1016/j.tafmec.2021.102993
Schools: School of Mechanical and Aerospace Engineering 
School of Electrical and Electronic Engineering 
Rights: © 2021 Elsevier Ltd. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
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