Please use this identifier to cite or link to this item:
Title: An experimental investigation of a PCM-based heat sink enhanced with a topology-optimized tree-like structure
Authors: Ho, Jin Yao
See, Yu Seon
Leong, Kin Chong
Wong, Teck Neng
Keywords: Engineering::Mechanical engineering
Issue Date: 2021
Source: Ho, J. Y., See, Y. S., Leong, K. C. & Wong, T. N. (2021). An experimental investigation of a PCM-based heat sink enhanced with a topology-optimized tree-like structure. Energy Conversion and Management, 245, 114608-.
Project: RG 92/18
Journal: Energy Conversion and Management
Abstract: A heat sink filled with phase change material (PCM) is an efficient thermal management device which utilizes the high latent heat of fusion of PCM in the cooling process. To improve the thermal performance of the PCM-based heat sink, a topology optimization (TO) strategy is devised to develop a new class of enhanced structures. This is achieved by carrying out a comprehensive numerical study to identify the effects of various thermal transport mechanisms on the TO design by considering two different heat transfer problems, i.e., steady-state heat conduction and transient heat conduction with phase change. To enable easy fabrication and performance evaluation of the new heat sink design predicted by the TO process, the resulting heat sink with tree-like structure was fabricated by selective laser melting (SLM), a metal additive manufacturing (AM) technique. Experimental characterization of the TO heat sink was carried out using three different types of PCMs, i.e., RT35, RT35HC and RT44HC and heat fluxes ranging from 4.00 kW/m2 to 7.24 kW/m2. Our experimental results show that the TO tree-like structure heat sink has better performance, exhibiting up to 4 °C lower wall temperatures, than the conventional fin-structure heat sink. At low heat fluxes, the best thermal performance can be obtained with RT35HC whereas at high heat fluxes, lower wall temperatures were achieved with RT44HC. In addition, the tree-like structure increases operational time by up to 13% as compared to the fin-structure heat sink. The better thermal performance of the tree-like structure heat sink is due to its optimized heat conduction paths that allow heat from the concentrated heat source to be efficiently dissipated to the PCM. This work not only demonstrates the potential of enhancing electronics cooling with TO PCM-based heat sinks, but it also outlines key guidelines for the design and implementation of TO structures for other cooling applications.
ISSN: 0196-8904
DOI: 10.1016/j.enconman.2021.114608
Schools: School of Mechanical and Aerospace Engineering 
Research Centres: Singapore Centre for 3D Printing 
Rights: © 2021 Elsevier Ltd. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MAE Journal Articles
SC3DP Journal Articles

Citations 10

Updated on Sep 30, 2023

Web of ScienceTM
Citations 10

Updated on Oct 1, 2023

Page view(s)

Updated on Oct 2, 2023

Google ScholarTM




Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.