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Title: Large-scale fabrication of surface ion traps on a 300 mm glass wafer
Authors: Tao, Jing
Likforman, Jean-Pierre
Zhao, Peng
Li, Hong Yu
Henner, Theo
Lim, Yu Dian
Seit, Wen Wei
Guidoni, Luca
Tan, Chuan Seng
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2021
Source: Tao, J., Likforman, J., Zhao, P., Li, H. Y., Henner, T., Lim, Y. D., Seit, W. W., Guidoni, L. & Tan, C. S. (2021). Large-scale fabrication of surface ion traps on a 300 mm glass wafer. Physica Status Solidi (B), 258(7), 2000589-.
Project: A1685b0005
Journal: Physica Status Solidi (B)
Abstract: Herein, a large-scale fabrication of radio frequency (RF) surface ion traps on a 300 mm glass wafer using a standard foundry process is reported. Established wafer-level packaging process of electroplated Cu with Au finish is used to fabricate the surface electrodes directly on the glass wafer substrate. A trap is tested by loading it with laser-cooled 88Sr+ ions. The trap shows a stable operation with RF amplitudes in the range of 100–250 V at 33 MHz frequency. The ion lifetime is on the order of 30 min with laser cooling with a vacuum chamber pressure of ≈5 × 10−11 mbar. These results demonstrate the potential of large-size foundry glass substrates to realize scalable and integratable trapped ion-based quantum devices.
ISSN: 0370-1972
DOI: 10.1002/pssb.202000589
Schools: School of Electrical and Electronic Engineering 
Rights: © 2021 Wiley-VCH GmbH. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
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