Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/160535
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dc.contributor.authorTeo, Adrian J. T.en_US
dc.contributor.authorLi, Holden King Hoen_US
dc.date.accessioned2022-07-26T06:36:04Z-
dc.date.available2022-07-26T06:36:04Z-
dc.date.issued2021-
dc.identifier.citationTeo, A. J. T. & Li, H. K. H. (2021). Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes. Micromachines, 12(12), 1481-. https://dx.doi.org/10.3390/mi12121481en_US
dc.identifier.issn2072-666Xen_US
dc.identifier.urihttps://hdl.handle.net/10356/160535-
dc.description.abstractA high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple wafer bonding. These out-of-plane comb drives are used for the bias actuation to achieve a larger tilt angle for micromirrors. The high-aspect-ratio mechanical structure is realized by the deep reactive ion etching of silicon, and the notching effect in silicon-on-insulator (SOI) wafers is minimized. The low-temperature bonding of two patterned wafers is achieved with fusion bonding, and a high bond strength up to 2.5 J/m2 is obtained, which sustains subsequent processing steps. Furthermore, the dependency of resonant frequency on device dimensions is studied systematically, which provides useful guidelines for future design and application. A finalized device fabricated here was also tested to have a resonant frequency of 17.57 kHz and a tilt angle of 70° under an AC bias voltage of 2 V.en_US
dc.language.isoenen_US
dc.relation.ispartofMicromachinesen_US
dc.rights© 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/).en_US
dc.subjectEngineering::Mechanical engineeringen_US
dc.titleRealization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processesen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.identifier.doi10.3390/mi12121481-
dc.description.versionPublished versionen_US
dc.identifier.pmid34945331-
dc.identifier.scopus2-s2.0-85122141955-
dc.identifier.issue12en_US
dc.identifier.volume12en_US
dc.identifier.spage1481en_US
dc.subject.keywords3D MEMSen_US
dc.subject.keywordsWafer Bondingen_US
dc.description.acknowledgementThis research was funded by the Defense Advanced Research Projects Agency (DARPA) under contract HR0011-09-2-0004.en_US
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