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https://hdl.handle.net/10356/160535
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DC Field | Value | Language |
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dc.contributor.author | Teo, Adrian J. T. | en_US |
dc.contributor.author | Li, Holden King Ho | en_US |
dc.date.accessioned | 2022-07-26T06:36:04Z | - |
dc.date.available | 2022-07-26T06:36:04Z | - |
dc.date.issued | 2021 | - |
dc.identifier.citation | Teo, A. J. T. & Li, H. K. H. (2021). Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes. Micromachines, 12(12), 1481-. https://dx.doi.org/10.3390/mi12121481 | en_US |
dc.identifier.issn | 2072-666X | en_US |
dc.identifier.uri | https://hdl.handle.net/10356/160535 | - |
dc.description.abstract | A high-aspect-ratio three-dimensionally (3D) stacked comb structure for micromirror application is demonstrated by wafer bonding technology in CMOS-compatible processes in this work. A vertically stacked comb structure is designed to circumvent any misalignment issues that could arise from multiple wafer bonding. These out-of-plane comb drives are used for the bias actuation to achieve a larger tilt angle for micromirrors. The high-aspect-ratio mechanical structure is realized by the deep reactive ion etching of silicon, and the notching effect in silicon-on-insulator (SOI) wafers is minimized. The low-temperature bonding of two patterned wafers is achieved with fusion bonding, and a high bond strength up to 2.5 J/m2 is obtained, which sustains subsequent processing steps. Furthermore, the dependency of resonant frequency on device dimensions is studied systematically, which provides useful guidelines for future design and application. A finalized device fabricated here was also tested to have a resonant frequency of 17.57 kHz and a tilt angle of 70° under an AC bias voltage of 2 V. | en_US |
dc.language.iso | en | en_US |
dc.relation.ispartof | Micromachines | en_US |
dc.rights | © 2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// creativecommons.org/licenses/by/ 4.0/). | en_US |
dc.subject | Engineering::Mechanical engineering | en_US |
dc.title | Realization of three-dimensionally MEMS stacked comb structures for microactuators using low-temperature multi-wafer bonding with self-alignment techniques in CMOS-compatible processes | en_US |
dc.type | Journal Article | en |
dc.contributor.school | School of Mechanical and Aerospace Engineering | en_US |
dc.identifier.doi | 10.3390/mi12121481 | - |
dc.description.version | Published version | en_US |
dc.identifier.pmid | 34945331 | - |
dc.identifier.scopus | 2-s2.0-85122141955 | - |
dc.identifier.issue | 12 | en_US |
dc.identifier.volume | 12 | en_US |
dc.identifier.spage | 1481 | en_US |
dc.subject.keywords | 3D MEMS | en_US |
dc.subject.keywords | Wafer Bonding | en_US |
dc.description.acknowledgement | This research was funded by the Defense Advanced Research Projects Agency (DARPA) under contract HR0011-09-2-0004. | en_US |
item.fulltext | With Fulltext | - |
item.grantfulltext | open | - |
Appears in Collections: | MAE Journal Articles |
Files in This Item:
File | Description | Size | Format | |
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micromachines-12-01481-v2.pdf | 2.19 MB | Adobe PDF | View/Open |
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