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dc.contributor.authorQiu, Huanen_US
dc.contributor.authorWang, Jinyuen_US
dc.contributor.authorTu, Pengfeien_US
dc.contributor.authorTang, Yien_US
dc.identifier.citationQiu, H., Wang, J., Tu, P. & Tang, Y. (2021). Device-level loss balancing control for modular multilevel converters. IEEE Transactions On Power Electronics, 36(4), 4778-4790.
dc.description.abstractModular multilevel converter (MMC) is a promising topology in medium/high-voltage applications for its merits, e.g., scalability, low output current total harmonic distortion, and high efficiency. But the reliability of MMCs is questionable due to more semiconductor devices used than other topologies. Another reliability problem of MMC is the significant uneven loss distribution between the top and bottom semiconductor devices within one submodule (SM) owing to the dc component in the arm currents. The stress difference caused by the uneven loss distribution between the top and bottom semiconductor modules will lead to the lifetime difference of the semiconductor devices, which shortens the lifetime of the whole MMC system. To extend the lifetime of MMCs without the modification of system hardware, this article proposes a device-level loss balancing control method. In this method, the accurate device loss models are established to feedback real-Time device losses into the loss balancing controller. The controller (by regulating the SM capacitor voltages) adjusts the semiconductor conducting duty cycles to even the loss distribution without affecting the performance of the ac output and capacitor-voltage balancing. The effectiveness of the proposed control method is validated through experimental results.en_US
dc.description.sponsorshipEnergy Market Authority (EMA)en_US
dc.relation.ispartofIEEE Transactions on Power Electronicsen_US
dc.rights© 2020 IEEE. All rights reserved.en_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleDevice-level loss balancing control for modular multilevel convertersen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.contributor.researchEnergy Research Institute @ NTU (ERI@N)en_US
dc.subject.keywordsActive Thermal Controlen_US
dc.subject.keywordsReliability Improvementen_US
dc.description.acknowledgementThis work was supported by the National Research Foundation, Prime Minister’s Office, Singapore, under the Energy Innovation Research Programme Energy Storage Grant Call and administrated by the Energy Market Authority under Grant NRF2015EWT-EIRP002-007.en_US
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