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Title: Device-level loss balancing control for modular multilevel converters
Authors: Qiu, Huan
Wang, Jinyu
Tu, Pengfei
Tang, Yi
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2021
Source: Qiu, H., Wang, J., Tu, P. & Tang, Y. (2021). Device-level loss balancing control for modular multilevel converters. IEEE Transactions On Power Electronics, 36(4), 4778-4790.
Project: NRF2015EWT-EIRP002-007
Journal: IEEE Transactions on Power Electronics
Abstract: Modular multilevel converter (MMC) is a promising topology in medium/high-voltage applications for its merits, e.g., scalability, low output current total harmonic distortion, and high efficiency. But the reliability of MMCs is questionable due to more semiconductor devices used than other topologies. Another reliability problem of MMC is the significant uneven loss distribution between the top and bottom semiconductor devices within one submodule (SM) owing to the dc component in the arm currents. The stress difference caused by the uneven loss distribution between the top and bottom semiconductor modules will lead to the lifetime difference of the semiconductor devices, which shortens the lifetime of the whole MMC system. To extend the lifetime of MMCs without the modification of system hardware, this article proposes a device-level loss balancing control method. In this method, the accurate device loss models are established to feedback real-Time device losses into the loss balancing controller. The controller (by regulating the SM capacitor voltages) adjusts the semiconductor conducting duty cycles to even the loss distribution without affecting the performance of the ac output and capacitor-voltage balancing. The effectiveness of the proposed control method is validated through experimental results.
ISSN: 0885-8993
DOI: 10.1109/TPEL.2020.3020973
Schools: School of Electrical and Electronic Engineering 
Research Centres: Energy Research Institute @ NTU (ERI@N) 
Rights: © 2020 IEEE. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles
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