Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/161062
Title: Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging
Authors: He, Hongying
Peng, Weixiang
Liu, Junbo
Chan, Xin Ying
Liu, Shike
Lu, Li
Le Ferrand, Hortense
Keywords: Engineering::Mechanical engineering
Issue Date: 2022
Source: He, H., Peng, W., Liu, J., Chan, X. Y., Liu, S., Lu, L. & Le Ferrand, H. (2022). Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging. Advanced Materials. https://dx.doi.org/10.1002/adma.202205120
Project: NRF-NRFF12-2020-0002
Journal: Advanced Materials
Abstract: Miniaturized and high-power density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct the heat towards heat sinks. Here, we create high thermal conductivity BN-based composites able to conduct heat intentionally towards specific areas by locally orienting magnetically functionalized BN microplatelets using magnetically assisted slip casting (MASC). The obtained thermal conductivity along the direction of alignment is unusually high, up to 12.1 W m-1 K-1 thanks to a high concentration of 62.6 vol% of BN in the composite, a low concentration in polymeric binder and a high degree of alignment. The BN composites have a low density of 1.3 g cm-3, a high stiffness of 442.3 MPa and are electrically insulating. Uniquely, we demonstrate our approach with proof-of-concept composites having locally graded orientations of BN microplatelets to direct the heat away from two vertically stacked heat sources. Rationally designing the microstructure of TIMs to direct heat strategically provides a promising solution for efficient thermal management in 3D integrated electronics.
URI: https://hdl.handle.net/10356/161062
ISSN: 0935-9648
DOI: 10.1002/adma.202205120
Schools: School of Mechanical and Aerospace Engineering 
School of Materials Science and Engineering 
Rights: This is the peer reviewed version of the following article: He, H., Peng, W., Liu, J., Chan, X. Y., Liu, S., Lu, L. & Le Ferrand, H. (2022). Microstructured BN composites with internally designed high thermal conductivity paths for 3D electronic packaging. Advanced Materials, which has been published in final form at https://doi.org/10.1002/adma.202205120. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles
MSE Journal Articles

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