Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/161454
Title: A mechanically interlocking strategy based on conductive microbridges for stretchable electronics
Authors: Zhu, Ming
Ji, Shaobo
Luo, Yifei
Zhang, Feilong
Liu, Zhihua
Wang, Changxian
Lv, Zhisheng
Jiang, Ying
Wang, Ming
Cui, Zequn
Li, Guanglin
Jiang, Longtao
Liu, Zhiyuan
Chen, Xiaodong
Keywords: Engineering::Materials
Engineering::Materials::Electronic packaging materials
Issue Date: 2022
Source: Zhu, M., Ji, S., Luo, Y., Zhang, F., Liu, Z., Wang, C., Lv, Z., Jiang, Y., Wang, M., Cui, Z., Li, G., Jiang, L., Liu, Z. & Chen, X. (2022). A mechanically interlocking strategy based on conductive microbridges for stretchable electronics. Advanced Materials, 34(7), 2101339-. https://dx.doi.org/10.1002/adma.202101339
Project: A18A1b0045 
Journal: Advanced Materials 
Abstract: Stretchable electronics incorporating critical sensing, data transmission, display and powering functionalities, is crucial to emerging wearable healthcare applications. To date, methods to achieve stretchability of individual functional devices have been extensively investigated. However, integration strategies of these stretchable devices to achieve all-stretchable systems are still under exploration, in which the reliable stretchable interconnection is a key element. Here, solderless stretchable interconnections based on mechanically interlocking microbridges are developed to realize the assembly of individual stretchable devices onto soft patternable circuits toward multifunctional all-stretchable platforms. This stretchable interconnection can effectively bridge interlayer conductivity with tight adhesion through both conductive microbridges and selectively distributed adhesive polymer. Consequently, enhanced stretchability up to a strain of 35% (R/R0  ≤ 5) is shown, compared with conventional solder-assisted connections which lose electrical conduction at a strain of less than 5% (R/R0  ≈ 30). As a proof of concept, a self-powered all-stretchable data-acquisition platform is fabricated by surface mounting a stretchable strain sensor and a supercapacitor onto a soft circuit through solderless interconnections. This solderless interconnecting strategy for surface-mountable devices can be utilized as a valuable technology for the integration of stretchable devices to achieve all-soft multifunctional systems.
URI: https://hdl.handle.net/10356/161454
ISSN: 0935-9648
DOI: 10.1002/adma.202101339
Schools: School of Materials Science and Engineering 
Organisations: Institute of Materials Research and Engineering, A*STAR 
Research Centres: Innovative Centre for Flexible Devices 
Rights: This is the peer reviewed version of the following article: Zhu, M., Ji, S., Luo, Y., Zhang, F., Liu, Z., Wang, C., Lv, Z., Jiang, Y., Wang, M., Cui, Z., Li, G., Jiang, L., Liu, Z. & Chen, X. (2022). A mechanically interlocking strategy based on conductive microbridges for stretchable electronics. Advanced Materials, 34(7), 2101339-, which has been published in final form at https://doi.org/10.1002/adma.202101339. This article may be used for non-commercial purposes in accordance with Wiley Terms and Conditions for Use of Self-Archived Versions.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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