Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/162498
Title: Plant-based substrate materials for flexible green electronics
Authors: Hwang, Youngkyu
Kim, Min Ku
Zhao, Ze
Kim, Bongjoong
Chang, Taehoo
Fan, Teng Fei
Ibrahim, Mohammed Shahrudin
Suresh, Subra
Lee, Chi Hwan
Cho, Nam-Joon
Keywords: Engineering::Materials
Issue Date: 2022
Source: Hwang, Y., Kim, M. K., Zhao, Z., Kim, B., Chang, T., Fan, T. F., Ibrahim, M. S., Suresh, S., Lee, C. H. & Cho, N. (2022). Plant-based substrate materials for flexible green electronics. Advanced Materials Technologies, 2200446-. https://dx.doi.org/10.1002/admt.202200446
Project: NRF-CRP10-2012-07
2017-T1-001-246 (RG51/17)
Journal: Advanced Materials Technologies
Abstract: With the increasing use of soft and flexible electronics, there is a growing need to develop substrate materials that mitigate potential environmental risks associated with non-degradable electronics waste from synthetic substrate materials. To address this issue, the authors develop a novel, 2D plant-based substrate termed “sporosubstrate”, which is made of non-allergenic natural pollen. The pollen particle has a double-layered architecture with an ultra-tough sporopollenin exine, and a soft cellulose intine is engineered through an eco-friendly process. In this manner, a readily available, economical, biodegradable, and biocompatible microgel can be prepared. This microgel can be used to create a variety of flexible shapes with customized mechanical, geometrical, electronic, and functional properties and performance characteristics such as thermal, chemical, and mechanical stability and optical transparency. Moreover, the authors demonstrate here different applications of the flexible natural substrate made of pollen microgel for use in electronic devices for health monitoring and wearable wireless heating. The results of this work point to opportunities for the development of a new class of flexible green electronics based on plant-based materials in applications such as wearable sensors, implantable devices, and soft robotics.
URI: https://hdl.handle.net/10356/162498
ISSN: 2365-709X
DOI: 10.1002/admt.202200446
Rights: © 2022 Wiley-VCH GmbH. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:MSE Journal Articles

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