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https://hdl.handle.net/10356/162857
Title: | Observation of topological edge states in thermal diffusion | Authors: | Hu, Hao Han, Song Yang, Yihao Liu, Dongjue Xue, Haoran Liu, Gui-Geng Cheng, Zheyu Wang, Qi Jie Zhang, Shuang Zhang, Baile Luo, Yu |
Keywords: | Engineering | Issue Date: | 2022 | Source: | Hu, H., Han, S., Yang, Y., Liu, D., Xue, H., Liu, G., Cheng, Z., Wang, Q. J., Zhang, S., Zhang, B. & Luo, Y. (2022). Observation of topological edge states in thermal diffusion. Advanced Materials, 34(31), 2202257-. https://dx.doi.org/10.1002/adma.202202257 | Project: | MOE 2018-T2-2-189 (S) MOE2019-T2-2-085 MOE2016‐T3‐1‐006 A20E5c0095 A18A7b0058 NRF-CRP18-2017-02 NRF-CRP22-2019-0006 NRF-CRP23-2019-0007 |
Journal: | Advanced Materials | Abstract: | The topological band theory predicts that bulk materials with nontrivial topological phases support topological edge states. This phenomenon is universal for various wave systems and has been widely observed for electromagnetic and acoustic waves. Here, we extend the notion of band topology from wave to diffusion dynamics. Unlike the wave systems that are usually Hermitian, the diffusion systems are anti-Hermitian with purely imaginary eigenvalues corresponding to decay rates. Via direct probe of the temperature diffusion, we experimentally retrieve the Hamiltonian of a thermal lattice, and observe the emergence of topological edge decays within the gap of bulk decays. Our results show that such edge states exhibit robust decay rates, which are topologically protected against disorders. This work constitutes a thermal analogue of topological insulators and paves the way to exploring defect-immune heat dissipation. | URI: | https://hdl.handle.net/10356/162857 | ISSN: | 0935-9648 | DOI: | 10.1002/adma.202202257 | Schools: | School of Electrical and Electronic Engineering School of Physical and Mathematical Sciences |
Research Centres: | Centre for Disruptive Photonic Technologies (CDPT) | Rights: | © 2022 The Authors. Advanced Materials published by Wiley-VCH GmbH. This is an open access article under the terms of the Creative Commons Attribution-NonCommercial-NoDerivs License, which permits use and distribution in any medium, provided the original work is properly cited, the use is non-commercial and no modifications or adaptations are made. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | EEE Journal Articles SPMS Journal Articles |
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