Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/163139
Title: Influence of thermal treatment on electronic properties of inkjet-printed zinc oxide semiconductor
Authors: Tran, Van-Thai
Wei, Yuefan
Du, Hejun
Keywords: Engineering::Mechanical engineering
Issue Date: 2022
Source: Tran, V., Wei, Y. & Du, H. (2022). Influence of thermal treatment on electronic properties of inkjet-printed zinc oxide semiconductor. International Journal of Smart and Nano Materials, 13(2), 330-345. https://dx.doi.org/10.1080/19475411.2022.2084172
Project: RG 96/18 
Journal: International Journal of Smart and Nano Materials 
Abstract: Additive manufacturing of electronic devices using inkjet printing provides a potential alternative approach in substitution for conventional electronic fabrication processes. However, the complex nature of inkjet printing involves the liquid deposition and film formation from the vaporization of solvent, which makes it different from film created by conventional deposition methods. Inkjet printing of zinc oxide (ZnO), which is a widely utilized semiconductor, produces polycrystalline film composed of nano-size grains, which could significantly influence the properties of printed film. In this study, low-temperature annealing was employed to treat inkjet-printed ZnO for UV photodetection application, and its influence on electrical properties was studied. Band bending was characterized using the Mott-Schottky plot which examines the charge distribution of the films. It is found that the annealing of inkjet-printed polycrystalline ZnO film has improved its electrical properties, which could be attributed to the reduction of band bending due to the merging of grains. The treatment also helps to reduce impurities of the film, such as zinc hydroxide complexes, which is common for solution-derived films. Hence, the study could pay the way for the improvement of electrical properties of inkjet-printed functional materials.
URI: https://hdl.handle.net/10356/163139
ISSN: 1947-5411
DOI: 10.1080/19475411.2022.2084172
Schools: School of Mechanical and Aerospace Engineering 
Research Centres: Singapore Centre for 3D Printing 
Rights: © 2022 The Author(s). Published by Informa UK Limited, trading as Taylor & Francis Group. This is an Open Access article distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Fulltext Permission: open
Fulltext Availability: With Fulltext
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