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Title: Review, classification and loss comparison of modular multilevel converter submodules for HVDC applications
Authors: Tian, Yumeng
Wickramasinghe, Harith R.
Li, Zixin
Pou, Josep
Konstantinou, Georgios
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2022
Source: Tian, Y., Wickramasinghe, H. R., Li, Z., Pou, J. & Konstantinou, G. (2022). Review, classification and loss comparison of modular multilevel converter submodules for HVDC applications. Energies, 15(6), 1985-.
Journal: Energies
Abstract: The circuit topology of a submodule (SM) in an modular multilevel converter (MMC) defines many of the functionalities of the complete power electronics conversion system and the specific applications that a specific MMC configuration can support. Most prominent among all applications for the MMC is its use in high-voltage direct current (HVDC) transmission systems and multiterminal dc grids. The aim of the paper is to provide a comprehensive review and classification of the many different SM circuit topologies that have been proposed for the MMC up to date. Using an 800-MVA, point-to-point MMC-based HVDC transmission system as a benchmark, the presented analysis identifies the limitations and drawbacks of certain SM configurations that limit their broader adoption as MMC SMs. A hybrid model of an MMC arm and appropriate implementations of voltage-balancing algorithms are used for detailed loss comparison of all SMs and to quantify differences among multiple SMs. The review also provides a comprehensive benchmark among all SM configurations, broad recommendations for the benefits and limitations of different SM topologies which can be further expanded based on the requirements of a specific application, and identifies future opportunities.
ISSN: 1996-1073
DOI: 10.3390/en15061985
Schools: School of Electrical and Electronic Engineering 
Rights: © 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https:// 4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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