Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/163203
Title: Fast parameter extraction of voxelized interconnects and circuits
Authors: Wang, Mingyu
Keywords: Engineering::Electrical and electronic engineering::Antennas, wave guides, microwaves, radar, radio
Issue Date: 2022
Publisher: Nanyang Technological University
Source: Wang, M. (2022). Fast parameter extraction of voxelized interconnects and circuits. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/163203
Abstract: Recent stunning developments in three-dimensional (3-D) printing technology have allowed the designers to produce their circuit boards and components at the convenience of their own laboratories. Such production potentially reduces the prototype development time from weeks to hours and is thereby expected to be widely preferred by the designers. The 3-D printers build the circuits/structures voxel by voxel (i.e., cube by cube). Therefore, the analysis and design tools that can be operated on the voxel-based discretizations are called for. Furthermore, virtual fabrication environments developed for modeling unit process steps of the semiconductors and micro-electro-mechanical systems are primarily voxel-based. By using these environments, the designers can iteratively explore their designs; they can alter their designs and check whether their designs meet certain design specifications. To check the performance of their designs, the designers are in need of electromagnetic (EM) simulators that can be used in conjunction with these virtual fabrication environments and operated on interconnects/circuits/structures discretized by voxels. Unfortunately, the current literature lacks studies on the development of such EM simulators. To fill this gap, three open source EM simulators that can be operated on voxelized interconnects/circuits/structures are proposed in this thesis.
URI: https://hdl.handle.net/10356/163203
DOI: 10.32657/10356/163203
Rights: This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License (CC BY-NC 4.0).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Theses

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