Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/164395
Title: Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times
Authors: Yan, Guangxu
Gill, Vincent
Gan, Chee Lip
Chen, Zhong
Keywords: Engineering::Materials
Issue Date: 2022
Source: Yan, G., Gill, V., Gan, C. L. & Chen, Z. (2022). Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times. Materials Characterization, 194, 112452-. https://dx.doi.org/10.1016/j.matchar.2022.112452
Journal: Materials Characterization
Abstract: Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical properties of joints with different bonding times was also investigated. In addition, the high-temperature (300 °C) thermal reliability of the Ni-Sn TLP bonded joints was explored with aging times from 0 h to 100 h. The results show that electroplated Ni-Sn TLP bonded joints exhibited a slightly higher average shear strength than those prepared using Sn foil and Sn96.5Ag3.5 paste. Also, the average shear strength of the electroplated Ni-Sn TLP bonded joints was greatly improved when the bonding time increased from 0.5 h to 5 h, while there was a continuous decrease in the average shear strength as the aging time was increased from 4 h to 100 h. During aging, the Ni/Ni3Sn2 interface was the preferential site for the nucleation of newly formed Ni3Sn2 intermetallic compounds (IMCs). Furthermore, the cross-sectional microstructure of the shear fractured joints after aging from 4 h to 100 h indicates that the shear fractures propagated through both the Ni3Sn4 IMCs and the Ni3Sn2/Ni3Sn4 interface.
URI: https://hdl.handle.net/10356/164395
ISSN: 1044-5803
DOI: 10.1016/j.matchar.2022.112452
Rights: © 2022 Elsevier Inc. All rights reserved. This paper was published in Materials Characterization and is made available with permission of Elsevier Inc..
Fulltext Permission: embargo_20250107
Fulltext Availability: With Fulltext
Appears in Collections:MSE Journal Articles

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