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dc.contributor.authorLinghu, Changhongen_US
dc.contributor.authorYang, Xudongen_US
dc.contributor.authorLiu, Yangchengyien_US
dc.contributor.authorLi, Dongen_US
dc.contributor.authorGao, Huajianen_US
dc.contributor.authorHsia, K. Jimmyen_US
dc.identifier.citationLinghu, C., Yang, X., Liu, Y., Li, D., Gao, H. & Hsia, K. J. (2023). Mechanics of shape-locking-governed R2G adhesion with shape memory polymers. Journal of the Mechanics and Physics of Solids, 170, 105091-.
dc.description.abstractShape memory polymers (SMPs), with unique properties such as tunable elastic modulus, temporary shape locking and shape recovery upon external stimulation, are emerging as a new class of smart materials with switchable adhesion capabilities. A prominent feature of the adhesion between SMP and a spherical indenter is the so-called R2G adhesion, defined as making contact in the rubbery state to a certain indentation depth followed by detachment in the glassy state. While it has been demonstrated that the R2G adhesion with SMPs can achieve orders of magnitude higher adhesive strength compared to conventional elastic adhesive systems with similar geometrical and adhesion parameters, the fundamental mechanics of R2G adhesion and why it leads to such tremendous adhesion enhancement remain largely mysterious at this point. Here, combined experimental testing, theoretical analysis, and finite element analysis (FEA) based on a thermomechanical constitutive model of SMP are performed to investigate the mechanics of R2G adhesion with a rigid spherical indenter. It is shown that the orders of magnitude enhancement of R2G adhesion over conventional elastic adhesion systems is mostly governed by the shape locking effect during the transition from the rubbery to glassy states. The shape locking effect freezes the deformed configuration of the SMP substrate, resulting in nearly conformal contact between the spherical indenter and the glassy-state SMP substrate, thus greatly increases the effective radius of curvature of the contact surface. Our experimental measurements and FEA analysis demonstrate that the net effect of shape locking leads to a pull-off force of a sphere nearly the same as that of a flat punch on an elastic half-space with the same contact radius. An explicit expression of the pull-off force for R2G adhesion is proposed based on flat-punch adhesion. Our results from combined experimentation, modeling and simulations reveal the fundamental mechanics of R2G adhesion. Such understanding provides guidance for the design of SMP smart adhesives.en_US
dc.description.sponsorshipAgency for Science, Technology and Research (A*STAR)en_US
dc.description.sponsorshipMinistry of Education (MOE)en_US
dc.description.sponsorshipNanyang Technological Universityen_US
dc.relationNTU-SUG 002271-00001en_US
dc.relationNTU-SUG 002479-00001en_US
dc.relation.ispartofJournal of the Mechanics and Physics of Solidsen_US
dc.rights© 2022 Elsevier Ltd. All rights reserved.en_US
dc.subjectEngineering::Mechanical engineeringen_US
dc.titleMechanics of shape-locking-governed R2G adhesion with shape memory polymersen_US
dc.typeJournal Articleen
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.schoolSchool of Chemical and Biomedical Engineeringen_US
dc.subject.keywordsShape Memory Polymersen_US
dc.subject.keywordsR2G Adhesionen_US
dc.description.acknowledgementThe authors acknowledge financial support by the Ministry of Education of Singapore under Academic Research Fund Tier 2 (T2EP50122-0005). C-H.L. acknowledges a Graduate Research Scholarship supported by the Ministry of Education of Singapore. Y.L. acknowledges the scholarship support as Visiting PhD Student from the China Scholarship Council. K.J.H. acknowledges a research start-up grant (002271-00001) from Nanyang Technological University. H.G. acknowledges a research start-up grant (002479-00001) from Nanyang Technological University and the Agency for Science, Technology and Research (A*STAR), and the use of the A*STAR Computational Resource Centre, Singapore (ACRC) and National Supercomputing Centre, Singapore (NSCC). H.G. and D.L. also acknowledge support from the Singapore Ministry of Education (MOE) AcRF Tier 1 (Grant RG120/21).en_US
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