Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/165630
Title: Easily applicable protocol to formulate inks for extrusion-based 3D printing
Authors: Tong, W.
Jaw, W. Q.
Pothunuri, L.
Soh, Eugene
Le Ferrand, Hortense
Keywords: Engineering::Mechanical engineering
Engineering::Materials
Issue Date: 2022
Source: Tong, W., Jaw, W. Q., Pothunuri, L., Soh, E. & Le Ferrand, H. (2022). Easily applicable protocol to formulate inks for extrusion-based 3D printing. Ceramica, 68(386), 152-159. https://dx.doi.org/10.1590/0366-69132022683863225
Project: NTU-SUG 
URECA 
Journal: Ceramica 
Abstract: 3D printing is a disruptive technology that is a key driver of the new industrial revolution. Among the various 3D printing methods, direct-ink-writing (DIW) takes a viscous ink material, extrudes it through a nozzle, and deposits it layer-by-layer to create 3D objects. DIW is a versatile method that can print ceramics, polymers, metals, living cells, etc. Yet, the ink formulation is critical for the success of printing. One major challenge to operate the transition to Industry 4.0 is to educate laypersons on 3D printing, without the need to master physics and chemistry. In this paper, we propose a protocol to familiarize laypersons with ink formulation for DIW. Using this protocol, a clay-based ink was optimized and the best ink composition containing 48 wt% clay and 2.4 wt% bamboo fibers was used for printing. The experimental set-ups and details used in the work are easily available, cheap, sustainable, and safe, enabling its implementation in various settings from classrooms to workshops, without the need for specialized equipment.
URI: https://hdl.handle.net/10356/165630
ISSN: 0366-6913
DOI: 10.1590/0366-69132022683863225
Schools: School of Mechanical and Aerospace Engineering 
School of Materials Science and Engineering 
Rights: This is an open-access article distributed under the terms of the Creative Commons Attribution License.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles
MSE Journal Articles

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