Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/165824
Title: Antireflective GaN nanoridge texturing by metal-assisted chemical etching via a thermally dewetted Pt catalyst network for highly responsive ultraviolet photodiodes
Authors: Liao, Yikai
Kim, You Jin
Lai, Junyu
Seo, Jung-Hun
Kim, Munho
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2023
Source: Liao, Y., Kim, Y. J., Lai, J., Seo, J. & Kim, M. (2023). Antireflective GaN Nanoridge Texturing by Metal-Assisted Chemical Etching via a Thermally Dewetted Pt Catalyst Network for Highly Responsive Ultraviolet Photodiodes. ACS Applied Materials and Interfaces, 15(10), 13343-13352. https://dx.doi.org/10.1021/acsami.2c22929
Project: A2084c0066 
M21K2c0107 
T2EP50120-0001 
Journal: ACS Applied Materials and Interfaces 
Abstract: Antireflective (AR) surface texturing is a feasible way to boost the light absorption of photosensitive materials and devices. As a plasma-free etching method, metal-assisted chemical etching (MacEtch) has been employed for fabricating GaN AR surface texturing. However, the poor etching efficiency of typical MacEtch hinders the demonstration of highly responsive photodetectors on an undoped GaN wafer. In addition, GaN MacEtch requires metal mask patterning by lithography, which leads to a huge processing complexity when the dimension of GaN AR nanostructure scales down to the submicron range. In this work, we have developed a facile texturing method of forming a GaN nanoridge surface on an undoped GaN thin film by a lithography-free submicron mask-patterning process via thermal dewetting of platinum. The nanoridge surface texturing effectively reduces the surface reflection in the ultraviolet (UV) regime, which can be translated to a 6-fold enhancement in responsivity (i.e., 115 A/W) of the photodiode at 365 nm. The results demonstrated in this work show that MacEtch can offer a viable route for enhanced UV light-matter interaction and surface engineering in GaN UV optoelectronic devices.
URI: https://hdl.handle.net/10356/165824
ISSN: 1944-8244
DOI: 10.1021/acsami.2c22929
Schools: School of Electrical and Electronic Engineering 
Rights: This document is the Accepted Manuscript version of a Published Work that appeared in final form in ACS Applied Materials and Interfaces, copyright © 2023 American Chemical Society, after peer review and technical editing by the publisher. To access the final edited and published work see https://doi.org/10.1021/acsami.2c22929
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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