Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/167764
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dc.contributor.authorLiu, Kunen_US
dc.date.accessioned2023-06-04T12:41:55Z-
dc.date.available2023-06-04T12:41:55Z-
dc.date.issued2023-
dc.identifier.citationLiu, K. (2023). Investigate mechanical & thermal properties of epoxy composites. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/167764en_US
dc.identifier.urihttps://hdl.handle.net/10356/167764-
dc.description.abstractIn this project, the mechanical properties and thermal properties of polymer composite materials obtained by using ceramic fillers are studied. The polymer matrix is epoxy resin and ceramic fillers are micro magnesia, nano Alumina & nano SiO2. The thermal conductivity of epoxy-based composites has been studied with various filler content. The result shows 15.2% volume fraction of micro MgO will lead to the percolation threshold of filler loading. At this loading, further adding nano Alumina will increase thermal conductivity through plane & in plane & thermal stability, but it will lead to porosity and high hardness. In contrast, the effect of nano SiO2 is not significant. The thermal conductivity is measured by the hot plate method and the hardness of samples is determined by the Vickers hardness testen_US
dc.language.isoenen_US
dc.publisherNanyang Technological Universityen_US
dc.subjectEngineering::Materialsen_US
dc.titleInvestigate mechanical & thermal properties of epoxy compositesen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorAravind Dasarien_US
dc.contributor.schoolSchool of Materials Science and Engineeringen_US
dc.description.degreeBachelor of Engineering (Materials Engineering)en_US
dc.contributor.supervisoremailaravind@ntu.edu.sgen_US
item.grantfulltextrestricted-
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Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)
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