Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/167977
Title: Heat conduction across interface between two materials. Part I: perfectly conducting interface
Authors: Ling, Yu Heng
Keywords: Engineering::Mathematics and analysis
Engineering::Mechanical engineering
Issue Date: 2023
Publisher: Nanyang Technological University
Source: Ling, Y. H. (2023). Heat conduction across interface between two materials. Part I: perfectly conducting interface. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/167977
Project: C004 
Abstract: This report presents a mathematical model for steady, two-dimensional heat conduction in rectangular coordinates. The model is developed using the Fourier heat conduction equation and accounts for the effects of thermal conductivity and boundary conditions. The numerical solution is obtained by expanding the Fourier heat conduction equation with the separation of variables and the trigonometric Fourier series, and the results are presented in the form of contour plots and heat maps depicting the temperature distribution. The model is validated by comparing the numerical results with analytical solutions for simple geometries. The limitations of the model, including the lack of inclusion of convection and radiation and the assumption of steady-state conditions, are discussed. This model is an attempt to produce a useful tool for predicting temperature distributions in complex geometries and can be used for designing and optimizing heat transfer systems.
URI: https://hdl.handle.net/10356/167977
Schools: School of Mechanical and Aerospace Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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