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Title: 3D printing with wire embedding
Authors: Lim, Zi Yun
Keywords: Engineering::Mechanical engineering
Issue Date: 2023
Publisher: Nanyang Technological University
Source: Lim, Z. Y. (2023). 3D printing with wire embedding. Final Year Project (FYP), Nanyang Technological University, Singapore.
Project: A163 
Abstract: The new frontier of additive manufacturing is the incorporation of multifunctional capabilities in 3D objects. One such application is in the field of 3D printed circuit boards. Nano Dimension is the pioneer of additively manufactured electronics technology, a distinct in-house method for producing printed circuit boards and other electronic devices. However, this technology is prohibitively expensive and not commonly available to the public. The wire embedding technique has emerged as a promising alternative that can produce 3D printed electronics. Traditionally, wire embedding has been done using custom-built 3D printers, but this project demonstrates that it can be achieved using consumer-based 3D printers. Instead of conventional 3D print material and conductive wire used in wire embedding, this project uses conductive PLA with nichrome wire embedding to explore the application of direct joule heating. This change in materials, however, requires variation in the embedding parameters such as nozzle temperature, dwell time and step length. In this project, the optimal nozzle temperature, dwell time, and step length for nichrome wire embedding were determined to be 260°C, 80 seconds, and 5mm respectively. Varying these parameters has produced different embedding qualities, with the optimal parameters resulting in the nichrome wire being embedded within the plastic print surface. This report shows the link between embedding parameters and embedding quality, which can be utilised to determine optimal embedding parameters for different print material and conductive wire configurations. This work presents promising results and opens new possibilities for the production of complex 3D prints with additional functionalities such as electric interconnects and direct joule heating. The accessibility and affordability of this technology are significantly improved as this report paves the way to bring embedded electronics to the masses through the use of consumer-grade 3D printers.
Schools: School of Mechanical and Aerospace Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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