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Title: Flexible integrated sensor with asymmetric structure for simultaneously 3D tactile and thermal sensing
Authors: Wang, Yongqing
Sun, Kun
Zhang, Qisheng
Yu, Samson Shenglong
Han, Boon Siew
Wang, Jianpeng
Zhao, Mingyan
Meng, Xianglin
Chen, Sicheng
Zheng, Yuanjin
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2023
Source: Wang, Y., Sun, K., Zhang, Q., Yu, S. S., Han, B. S., Wang, J., Zhao, M., Meng, X., Chen, S. & Zheng, Y. (2023). Flexible integrated sensor with asymmetric structure for simultaneously 3D tactile and thermal sensing. Biosensors and Bioelectronics, 224, 115054-.
Project: ICP1900093 
Journal: Biosensors and Bioelectronics 
Abstract: The human body detects tactile stimuli through a combination of pressure force and temperature signals via various cutaneous receptors. The development of a multifunctional artificial tactile perception system has potential benefits for future robotic technologies, human-machine interfaces, artificial intelligence, and health monitoring devices. However, constructing systems beyond simple pressure sensing capabilities remains challenging. Here, we propose an artificial flexible and ultra-thin (50 μ m) skin system to simultaneously capture 3D tactile and thermal signals, which mimics the human tactile recognition process using customized sensor pairs and compact peripheral signal-converting circuits. The 3D tactile sensors have a flower-like asymmetric structure with 5-ports and 4 capacitive elements in pairs. Differential and average signals would reveal the curl and amplitude values of the fore field with a resolution of 0.18/mm. The resistive thermal sensors are fabricated with serpentine lines and possess stable heat-sensing performance (165 mV/°C) under shape deformation conditions. Real-time monitoring of the skin stimuli is displayed on the user interface and stored on mobile clients. This work offers broad capabilities relevant to practical applications ranging from assistant prosthetics to artificial electronic skins.
ISSN: 0956-5663
DOI: 10.1016/j.bios.2022.115054
Schools: School of Electrical and Electronic Engineering 
Research Centres: Schaeffler Hub for Advanced Research (SHARE@NTU)
Rights: © 2022 Elsevier B.V. All rights reserved.
Fulltext Permission: none
Fulltext Availability: No Fulltext
Appears in Collections:EEE Journal Articles

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