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dc.contributor.authorLiu, Meichien_US
dc.identifier.citationLiu, M. (2023). Design of a high bandwidth high efficiency amplifier for high-speed communication. Final Year Project (FYP), Nanyang Technological University, Singapore.
dc.description.abstractWith the development of 5G/6G high speed, high bandwidth communications, it is critical to design circuits that be used for high-speed communication. Among all the circuit components inside a smartphone, the Radio frequency circuit plays an important role in charge of the wireless communications. Among all the circuit blocks inside the circuit, radio frequency power amplifier consumes most of the power inside the circuit. Therefore, an envelope tracking modular can be used to help reduce up to 86% of the power consumption of the circuit [1] since It generates a variable output voltage/supply voltage to the RF PAs. When the output of the RF PA is high, the ETM output is high, and vice versa. A class-AB linear amplifier can be designed to provide high frequency components to the RF PA. Therefore, in the project, a class-AB amplifier was designed and examined for the specifications related to fulfill the need of the high-speed communications. These design and simulation results can be a starting point for more advanced design in the future research.en_US
dc.publisherNanyang Technological Universityen_US
dc.subjectEngineering::Electrical and electronic engineeringen_US
dc.titleDesign of a high bandwidth high efficiency amplifier for high-speed communicationen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorChang Josephen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineering (Electrical and Electronic Engineering)en_US
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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