Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/169748
Title: Streamline diffusion finite element method for singularly perturbed 1D-parabolic convection diffusion differential equations with line discontinuous source
Authors: Soundararajan, R.
Subburayan, V.
Wong, Patricia Jia Ying
Keywords: Engineering::Electrical and electronic engineering
Issue Date: 2023
Source: Soundararajan, R., Subburayan, V. & Wong, P. J. Y. (2023). Streamline diffusion finite element method for singularly perturbed 1D-parabolic convection diffusion differential equations with line discontinuous source. Mathematics, 11(9), 2034-. https://dx.doi.org/10.3390/math11092034
Journal: Mathematics 
Abstract: This article presents a study on singularly perturbed 1D parabolic Dirichlet’s type differential equations with discontinuous source terms on an interior line. The time derivative is discretized using the Euler backward method, followed by the application of the streamline–diffusion finite element method (SDFEM) to solve locally one-dimensional stationary problems on a Shishkin mesh. Our proposed method is shown to achieve first-order convergence in time and second-order convergence in space. Our proposed method offers several advantages over existing techniques, including more accurate approximations of the solution on the boundary layer region, better efficiency, and robustness in dealing with discontinuous line source terms. The numerical examples presented in this paper demonstrate the effectiveness and efficiency of our method, which has practical applications in various fields, such as engineering and applied mathematics. Overall, our proposed method provides an effective and efficient solution to the challenging problem of solving singularly perturbed parabolic differential equations with discontinuous line source terms, making it a valuable tool for researchers and practitioners in various domains.
URI: https://hdl.handle.net/10356/169748
ISSN: 2227-7390
DOI: 10.3390/math11092034
Schools: School of Electrical and Electronic Engineering 
Rights: © 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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