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Title: Monolithic infrared silicon photonics: the rise of (Si)GeSn semiconductors
Authors: Moutanabbir, Oussama
Assali, Simone
Gong, Xiao
O'Reilly, Eoin
Broderick, Chris A.
Marzban, Bahareh
Witzens, Jeremy
Du, Wei
Yu, Shui-Qing
Chelnokov, Alexei
Buca, Dan
Nam, Donguk
Keywords: Engineering::Materials::Photonics and optoelectronics materials
Issue Date: 2021
Source: Moutanabbir, O., Assali, S., Gong, X., O'Reilly, E., Broderick, C. A., Marzban, B., Witzens, J., Du, W., Yu, S., Chelnokov, A., Buca, D. & Nam, D. (2021). Monolithic infrared silicon photonics: the rise of (Si)GeSn semiconductors. Applied Physics Letters, 118(11), 110502-.
Project: NRF-CRP19-2017-01 
Journal: Applied Physics Letters 
Abstract: (Si)GeSn semiconductors are finally coming of age after a long gestation period. The demonstration of device quality epi-layers and quantum-engineered heterostructures has meant that tunable all-group IV Si-integrated infrared photonics is now a real possibility. Notwithstanding the recent exciting developments in (Si)GeSn materials and devices, this family of semiconductors is still facing serious limitations that need to be addressed to enable reliable and scalable applications. The main outstanding challenges include the difficulty to grow high crystalline quality layers and heterostructures at the desired Sn content and lattice strain, preserve the material integrity during growth and throughout device processing steps, and control doping and defect density. Other challenges are related to the lack of optimized device designs and predictive theoretical models to evaluate and simulate the fundamental properties and performance of (Si)GeSn layers and heterostructures. This Perspective highlights key strategies to circumvent these hurdles and bring this material system to maturity to create far-reaching new opportunities for Si-compatible infrared photodetectors, sensors, and emitters for applications in free-space communication, infrared harvesting, biological and chemical sensing, and thermal imaging.
ISSN: 0003-6951
DOI: 10.1063/5.0043511
Schools: School of Electrical and Electronic Engineering 
Rights: © 2021 Author(s). All rights reserved. This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in [Citation of published article] and may be found at
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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