Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/171739
Title: Increased interlayer bonding strength of short carbon fiber composite fabricated by material extrusion via warm isostatic pressing (WIP) process
Authors: Park, Seong Jun
Kim, Do Hyun
Ju, Ho Gi
Park, Seong Je
Hong, Sukjoon
Son, Yong
Ahn, Il Hyuk
Keywords: Engineering::Mechanical engineering
Issue Date: 2023
Source: Park, S. J., Kim, D. H., Ju, H. G., Park, S. J., Hong, S., Son, Y. & Ahn, I. H. (2023). Increased interlayer bonding strength of short carbon fiber composite fabricated by material extrusion via warm isostatic pressing (WIP) process. Journal of Materials Research and Technology, 25, 3610-3623. https://dx.doi.org/10.1016/j.jmrt.2023.06.130
Journal: Journal of Materials Research and Technology 
Abstract: Recently, short carbon fiber-reinforced plastic (SFRP) has been selected as a filament material to improve the strength of components fabricated by material extrusion (ME). However, despite the improved material properties, the weak interlayer bonding and voids present in the microstructure constitute defects that cause anisotropy in the SFRP composite and deteriorate its mechanical properties such as the tensile, compressive, and flexural strengths. In this study, warm isostatic pressing (WIP) was investigated as a means to increase the interlayer bonding force and reduce the voids. To increase the efficiency of WIP, vacuum packing was investigated as a means to promote interfacial strength and diffusion between the layers. The WIP process improved the tensile, compressive, and flexural properties, and the anisotropy decreased with increasing interlayer bonding force. In addition, the thermal properties improved with an increase in the degree of crystallinity, and the voids in the microstructure were effectively reduced. These results indicate that WIP is a promising post-processing treatment for ME-fabricated SFRP parts.
URI: https://hdl.handle.net/10356/171739
ISSN: 2238-7854
DOI: 10.1016/j.jmrt.2023.06.130
Schools: School of Mechanical and Aerospace Engineering 
Rights: © 2023 The Authors. Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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