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https://hdl.handle.net/10356/173781
Title: | Carbon taxation in Singapore's semiconductor sector: a mini-review on GHG emission metrics and reporting | Authors: | Li, Yuanzhe Wang, Yan Chong, Daphne Xu, Zhongqi Li, Luzi Hu, Yuchun |
Keywords: | Engineering | Issue Date: | 2023 | Source: | Li, Y., Wang, Y., Chong, D., Xu, Z., Li, L. & Hu, Y. (2023). Carbon taxation in Singapore's semiconductor sector: a mini-review on GHG emission metrics and reporting. Carbon Research, 2(1). https://dx.doi.org/10.1007/s44246-023-00082-0 | Project: | SCU-001 | Journal: | Carbon Research | Abstract: | The threat of climate change has catalyzed global endeavors to curb greenhouse gas emissions, with carbon taxation emerging as a pivotal policy instrument. Singapore, akin to Taiwan, has embraced this tool, and its ramifications on their semiconductor industry are both profound and multifaceted. At the outset, the imposition of carbon taxes inevitably escalates production costs for semiconductor firms, compelling them to offset their carbon footprint financially. This escalation, in turn, poses a risk of eroding the industry's competitive edge, nudging firms to contemplate the prospect of migrating to locales with more lenient carbon taxation regimes. However, in juxtaposition to these challenges, carbon taxation unveils a silver lining. It instigates semiconductor entities to recalibrate their operations, infusing energy-efficient technologies and pivoting towards renewable energy avenues. Such transitions not only attenuate their carbon emissions but also curtail their financial burden arising from carbon taxation. This manuscript elucidates a panoramic landscape of both policy innovations and technological strides specific to Singapore's semiconductor arena. It aims to be an instrumental compass for stakeholders, delineating pathways for achieving optimal eco-financial equilibrium in the sector. | URI: | https://hdl.handle.net/10356/173781 | ISSN: | 2731-6696 | DOI: | 10.1007/s44246-023-00082-0 | Schools: | School of Materials Science and Engineering | Rights: | © The Author(s) 2023. Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/. | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
Appears in Collections: | MSE Journal Articles |
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