Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/174193
Title: 3D spheroid-microvasculature-on-a-chip for tumor-endothelium mechanobiology interplay
Authors: Zhang, Yingqi
Jiang, Fengtao
Zhao, Charles Yunduo
Cho, Ann-Na
Fang, Guocheng
Cox, Charles D.
Zreiqat, Hala
Lu, Zu Fu
Lu, Hongxu
Ju, Arnold Lining
Keywords: Engineering
Issue Date: 2023
Source: Zhang, Y., Jiang, F., Zhao, C. Y., Cho, A., Fang, G., Cox, C. D., Zreiqat, H., Lu, Z. F., Lu, H. & Ju, A. L. (2023). 3D spheroid-microvasculature-on-a-chip for tumor-endothelium mechanobiology interplay. Biomedical Materials, 18(5), 055008-. https://dx.doi.org/10.1088/1748-605X/ace7a4
Journal: Biomedical Materials 
Abstract: During the final stage of cancer metastasis, tumor cells embed themselves in distant capillary beds, from where they extravasate and establish secondary tumors. Recent findings underscore the pivotal roles of blood/lymphatic flow and shear stress in this intricate tumor extravasation process. Despite the increasing evidence, there is a dearth of systematic and biomechanical methodologies that accurately mimic intricate 3D microtissue interactions within a controlled hydrodynamic microenvironment. Addressing this gap, we introduce an easy-to-operate 3D spheroid-microvasculature-on-a-chip (SMAC) model. Operating under both static and regulated flow conditions, the SMAC model facilitates the replication of the biomechanical interplay between heterogeneous tumor spheroids and endothelium in a quantitative manner. Serving as anin vitromodel for metastasis mechanobiology, our model unveils the phenomena of 3D spheroid-induced endothelial compression and cell-cell junction degradation during tumor migration and expansion. Furthermore, we investigated the influence of shear stress on endothelial orientation, polarization, and tumor spheroid expansion. Collectively, our SMAC model provides a compact, cost-efficient, and adaptable platform for probing the mechanobiology of metastasis.
URI: https://hdl.handle.net/10356/174193
ISSN: 1748-6041
DOI: 10.1088/1748-605X/ace7a4
Schools: School of Electrical and Electronic Engineering 
Rights: © 2023 The Author(s). Published by IOP Publishing Ltd. Original content from this work may be used under the terms of the Creative Commons Attribution 4.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:EEE Journal Articles

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