Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/174912
Title: A strong fracture-resistant high-entropy alloy with nano-bridged honeycomb microstructure intrinsically toughened by 3D-printing
Authors: Kumar, Punit
Huang, Sheng
Cook, David H.
Chen, Kai
Ramamurty, Upadrasta
Tan, Xipeng
Ritchie, Robert O.
Keywords: Engineering
Issue Date: 2024
Source: Kumar, P., Huang, S., Cook, D. H., Chen, K., Ramamurty, U., Tan, X. & Ritchie, R. O. (2024). A strong fracture-resistant high-entropy alloy with nano-bridged honeycomb microstructure intrinsically toughened by 3D-printing. Nature Communications, 15(1), 841-. https://dx.doi.org/10.1038/s41467-024-45178-2
Project: A18B1b0061 
Journal: Nature Communications 
Abstract: Strengthening materials via conventional "top-down" processes generally involves restricting dislocation movement by precipitation or grain refinement, which invariably restricts the movement of dislocations away from, or towards, a crack tip, thereby severely compromising their fracture resistance. In the present study, a high-entropy alloy Al0.5CrCoFeNi is produced by the laser powder-bed fusion process, a "bottom-up" additive manufacturing process similar to how nature builds structures, with the microstructure resembling a nano-bridged honeycomb structure consisting of a face-centered cubic (fcc) matrix and an interwoven hexagonal net of an ordered body-centered cubic B2 phase. While the B2 phase, combined with high-dislocation density and solid-solution strengthening, provides strength to the material, the nano-bridges of dislocations connecting the fcc cells, i.e., the channels between the B2 phase on the cell boundaries, provide highways for dislocation movement away from the crack tip. Consequently, the nature-inspired microstructure imparts the material with an excellent combination of strength and toughness.
URI: https://hdl.handle.net/10356/174912
ISSN: 2041-1723
DOI: 10.1038/s41467-024-45178-2
Schools: School of Mechanical and Aerospace Engineering 
Organisations: Institute of Materials Research and Engineering, A*STAR 
Rights: This is a U.S. Government work and not under copyright protection in the US; foreign copyright protection may apply 2024. Open Access. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/ licenses/by/4.0/.
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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