Enhancing rework techniques in microelectronics components for reusability

Abstract

The demand for smartphones, wearable devices, and Internet of Things applications has led to a trend in miniaturizing packages and printed circuit boards (PCB). Package-on-Package (PoP) components have risen in popularity due to their capability of stacking vertically on top of each other, enabling increased functionality within a limited space while maintaining high performance and reliability. When combined with Ball Grid Array (BGA) technology, BGA with PoP configurations offer enhanced integration capabilities, improved signal integrity, and optimized space utilization in modern electronic designs. In the event of a package failure, the package must undergo rework and replacement to restore the functionality of the PCB and, consequently, the normal operation of the electronic device. However, the BGA PoP rework process presents several common challenges due to the fragility and compact size of these components. This project addresses the challenges associated with reworking a BGA PoP by proposing improvements to reduce or eliminate these challenges. Rework methods were successfully improved and complemented by thorough inspections utilizing X-ray and Optical Microscopy to demonstrate the outcomes. By implementing enhanced reworking techniques for BGA PoP components, the complexities associated with rework processes are expected to be significantly reduced, thereby promoting rework practices and enhancing the reusability of electronic devices.