Integrated 3D inductors

Abstract

This Final Year Project pertains to the design and verification of integrated 3D inductors for high-frequency applications, such as integrated power management systems and wireless communications. These applications demand inductors that possess high inductance values, low losses, and compact form factors; yet are feasible and cost-efficient to fabricate. At present, these characteristics cannot be achieved simultaneously using conventional inductor technologies, whether they are discrete, on-chip, or in-package (e.g. using bonding-wires).

This project aims to develop a new methodology for implementing inductors by embedding them within the printed circuit board (PCB). Additionally, magnetic cores will be integrated in a similar manner to enhance the inductance values. Inductor design topologies will be investigated, and their inductances will be verified using electromagnetic field solver simulations. The resulting inductor designs are expected to exhibit high inductance values, while also simultaneously featuring low loss, compact form factors, and low cost due to their integration within the PCB.