Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/177880
Title: Apply thermal conductive composites for thermal management of electronic device
Authors: Lee, Linus Wei Jie
Keywords: Engineering
Issue Date: 2024
Publisher: Nanyang Technological University
Source: Lee, L. W. J. (2024). Apply thermal conductive composites for thermal management of electronic device. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/177880
Project: A046 
Abstract: The efficient thermal management of electronic devices is paramount for ensuring optimal performance and longevity. In this paper, we explored the application of boron nitride (BN) composites as promising candidates for enhancing thermal management in electronic devices. Through a comprehensive investigation employing scanning electron microscopy (SEM), surface roughness measurement analysis, and extensive experimental runs, we illustrated the influence of internal microstructure alignment on thermal performance. SEM imaging unveiled distinct conformation factors associated with different alignments within the microstructure of BN composites. Concurrently, surface roughness measurements provided valuable insights into the surface properties of these composites across various alignment configurations. Subsequent experimental runs simulated real-world conditions and yielded crucial parameters including maximum stable temperature, time to reach maximum stable temperature, initial heating rate, and cooling rate. Our findings reveal that BN composites with a vertical alignment exhibit superior thermal management capabilities compared to other alignments. Specifically, the vertically aligned composites showcased the lowest maximum stable temperature, fastest time to reach maximum stable temperature, highest initial heating rate, and highest cooling rate. These results underscore the significance of microstructure alignment in optimising thermal performance and suggest the potential of purposefully-induced alignment of BN composites for effective heat dissipation and thermal management in electronic devices. With the complexity of real-world electronic devices, BN composites fabricated using MASC could represent a promising and versatile solution for a wide variety of requirements and use-cases.
URI: https://hdl.handle.net/10356/177880
Schools: School of Mechanical and Aerospace Engineering 
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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