Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/181682
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dc.contributor.authorNotaria Manav Baijuen_US
dc.date.accessioned2024-12-15T23:57:12Z-
dc.date.available2024-12-15T23:57:12Z-
dc.date.issued2024-
dc.identifier.citationNotaria Manav Baiju (2024). Peel stress analysis of composite joints for debonding. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/181682en_US
dc.identifier.urihttps://hdl.handle.net/10356/181682-
dc.description.abstractAdhesive bonding is a prevalent method employed in the fabrication of advanced technical products featuring intricate geometries. This research aims to examine the failure attributes of adhesives with and without Thermoexpancel particles. Glass Fibre Reinforced Polymer (GFRP) and Aluminium Steel Strip (Al) were bonded using 3M™ Scotch Weld™ Epoxy Adhesive DP460 and 3M™ Scotch-Weld™ Epoxy Adhesive DP100, mixed with varying weights of Thermoexpancel particles. The performance of these adhesives was tested under normal room temperature conditions using a customized Floating Roller Peel Test coupled with a Tensile Test machine. This study provides insights into the load-displacement behaviour and failure mechanisms of the adhesives, contributing to the understanding and optimization of debonding techniques for composite materials.en_US
dc.language.isoenen_US
dc.publisherNanyang Technological Universityen_US
dc.subjectEngineeringen_US
dc.titlePeel stress analysis of composite joints for debondingen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorSridhar Idapalapatien_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor's degreeen_US
dc.contributor.supervisoremailMSridhar@ntu.edu.sgen_US
dc.subject.keywordsAdhesivesen_US
dc.subject.keywordsDebondingen_US
dc.subject.keywordsPeel testen_US
dc.subject.keywordsAerospaceen_US
dc.subject.keywordsAircraften_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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