Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/182019
Title: Granular metamaterials with dynamic bond reconfiguration
Authors: Meng, Zhiqiang
Yan, Hujie
Wang, Yifan
Keywords: Engineering
Issue Date: 2024
Source: Meng, Z., Yan, H. & Wang, Y. (2024). Granular metamaterials with dynamic bond reconfiguration. Science Advances, 10(49), eadq7933-. https://dx.doi.org/10.1126/sciadv.adq7933
Project: MOE-T2EP50123-0015 
M21K2c0118 
NAP 020482 
Journal: Science Advances 
Abstract: Biological materials dynamically reconfigure their underlying structures in response to stimuli, achieving adaptability and multifunctionality. Conversely, mechanical metamaterials have fixed interunit connections that restrict adaptability and reconfiguration. This study introduces granular metamaterials composed of discrete bimaterial structured particles that transition between assembled and unassembled states through mechanical compression and thermal stimuli. These materials enable dynamic bond reconfiguration, allowing reversible bond breaking and formation, similar to natural systems. Leveraging their discrete nature, these materials can adaptively reconfigure their shape and respond dynamically to varying conditions. Our investigations reveal that these granular metamaterials can substantially alter their mechanical properties, like compression, shearing, and bending, offering tunable mechanical characteristics across different states. Furthermore, they exhibit collective behaviors like directional movement, object capture, transportation, and gap crossing, showcasing their potential for reprogrammable functionalities. This work highlights the dynamic reconfigurability and robust adaptability of granular metamaterials, expanding their potential in responsive architecture and autonomous robotics.
URI: https://hdl.handle.net/10356/182019
ISSN: 2375-2548
DOI: 10.1126/sciadv.adq7933
Schools: School of Mechanical and Aerospace Engineering 
Rights: © 2024 the Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC).
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Journal Articles

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