DUV laser direct writing lithograph for metaoptics

Abstract

Deep ultraviolet (DUV) laser direct writing lithography (LDWL) is a promising maskless lithography technique that enables high-resolution patterning with submicron precision. This study explores the optimization of LDWL for nanoscale fabrication and evaluates its potential as a cost-effective alternative to electron beam lithography (EBL). The ability to precisely control feature dimensions, coupled with its maskless and flexible processing nature, positions LDWL as a powerful tool for photonic device engineering, structural color imaging, and advanced microelectronic applications.